Brochures Leaflets & Data Sheets

Company Brochures

DYCONEX Company Brochure (PDF)
LITRONIK Company Brochure (PDF)
MSEB Company Brochure (PDF)

Conformity Declaration

DYCONEX REACH Conformity (PDF)
DYCONEX RoHs Conformity Declaration (PDF)

Technology Leaflets

Semiconductor Technology (PDF)
Assembly Technology (PDF)
Interconnect Technology (PDF)
Battery Technology (PDF)
Flexible Electronic Assemblies for Medical Ultrasound Imaging (PDF)

Interconnect Organic

Full Flex & Felx Rigidized for Folding (PDF)
HDI & Ultra-HDI Flex (PDF)
HDI & Ultra-HDI Multilayer Rigid (PDF)
Liquid Crystal Polymer (LPC) (PDF)
Materials (PDF)
Rigid-flex (PDF)
Advanced Rigid Substrates for HF Applications, Ultra-thin Bild-ups and Chip Packages (PDF)
Smallest form Factor Acitve NFC Tag for Sensor Applications in Harsh Enviroments (PDF)
Interconnect Solutions such as Wrap-Around PCBs for Optimal Thermal Management (PDF)
Biocompatile Flexible Substrates for Directly Implantable Applications (PDF)
Advanced LCP Substrates for HF & Microwave Applications (PDF)

Interconnect Ceramic

LTCC Substrates (PDF)

Battery Data Sheets

High Energy Batteries

LiS 2250 High Energy (PDF)
LiS 2650 High Energy (PDF)
LiS 3150 High Energy (PDF)

Medium Rate Batteries

LiS 2044 Medium Rate (PDF)
LiS 2044K Medium Rate (PDF)
LiS 2460 Medium Rate (PDF)
LiS 2650M Medium Rate (PDF)
LiS 3150M Medium Rate (PDF)

High Power Batteries

LiS 2592 High Power (PDF)