Interconnect Ceramic

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Interconnect ceramic

In addition to standard thick film substrates, we manufacture highly complex multilayer LTCC (Low Temperature Co-fired Ceramic) substrates according to your specific needs. Furthermore, we offer concepts and design support for HTCC (High Temperature Co-fired Ceramic) technology.


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  • Multilayer technology up to more than 20 layers
  • 3-dimensional design
  • Fine line patterning
  • Excellent RF performance up to 120 GHz
  • Trimmable thick film resistors on outer surface
  • Embedded passive components
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  • Thick film ceramic (96% alumina)
  • Well suited for small geometry, high resistor value circuitry
  • Multiple layer structures – single sided with single layer to multilayer on two sides
  • Wide range of conductor materials